A customer requested some support with one of their products, an IoT bridge device that takes various sensors and provides telemetry back to a central server using a GSM module. Some of the radio pre-compliance spurious emissions testing had suggested there might be some issues at certain frequencies.
After a couple of hours of radiated emissions measurements in the anechoic chamber and some bench work with some near field probes, I’d developed a pretty good idea of what was going on in terms of where the emissions were coming from and what their radiating mechanisms were.
Interestingly, there was a common theme to all of these emissions…
These features are common to a wide range of similar devices so some notes and a simple drawing (oddly I find sketching like this a good way to relax!) are presented in the hope it will give you some ideas about where your radiated emissions might be coming from.
The sketch shows a keypad board, a CPU board and a battery pack. Some other information is missing to permit a simpler drawing. All of these boards below sandwich together nicely into a plastic case which was the starting point for the investigation.
The problem frequencies identified were a 300MHz narrowband spike and a 250MHz broadband hump. Usually when I see broadband I think “power supply noise” and narrowband I think “digital noise”.
Let’s take a wander around the device.
Capacitive plate near field probing around (A) showed higher than background levels of 300MHz noise around the front panel button board. Since this was a “dumb” board, the noise was probably coming from the main CPU board. The noise emanating from the cable (B) was not appreciably higher but when approaching the CPU/memory the noise increased, the clock line between the memory device and CPU being the highest.
Two possibilities were that there was crosstalk on the PCB at (C) or perhaps inside the CPU itself but without getting into more complex analysis the exact cause is not known. Apart from the power lines, there was no extra HF filtering on the data lines, just a series resistor on the I/O lines of the CPU. The addition of a small capacitor (e.g. 47pF, either 0402 or an array) on each line to circuit ground forms an RC filter to roll off any unwanted HF emissions like this. I generally advocate making provision for such devices on the PCB but not fitting them unless required – better to provision for and not need than to require a PCB re-spin later in the development cycle.
Moving the near field probe around the bottom of the case where the battery lives (D) showed the broad 250MHz hump present on the battery. Unplugging the battery pack made the emissions drop by 10dBuV/m and measuring with a high bandwidth passive probe showed broadband noise present on the outputs of the battery charger (E) from the switching converter. Some low-ohm ferrite beads in series with the battery terminals will help keep this noise on board and prevent common mode emissions from the battery and cables (F).
Lastly, the antenna was unplugged and some other broadband noise was found on the cable (G) at 360MHz, this time from the main 5V DC/DC converter on the main PCB.
So what is the common theme? All the radiation problems stem from cables connected to the main PCB. As soon as you add a cable to a system you are creating a conductor with a poorly controlled return path or “antenna” as they are sometimes known in the EMC department!
Treat any cable or connector leaving your PCB as an EMC hazard. You have less control over the HF return paths in the cable environment than you do on the PCB. Apply appropriate HF filtering to the lines on the cable and remember that even a shielded cable can cause problems.
Sometimes, like the antenna cable, there’s not a lot you can do about it other than practice good design partitioning to keep noisy sources away from the cable and to apply a ferrite core around the cable if it becomes a problem during testing.
I hope you found this useful and that it has given you some pointers for looking at your own designs with a new perspective.